DARPA Schedules Briefings on Wafer Bonding of Thin-Film Crystals for Advanced Sensors and Communications
March 25, 2025 – U.S. military researchers are preparing to inform the industry about innovative wafer bonding methods for thin-film crystals. These advancements are expected to enhance capabilities in sensing and communications, incorporating integrated quantum, photonic, terahertz, radio frequency, and actuator technologies.
The U.S. Defense Advanced Research Projects Agency (DARPA), located in Arlington, Virginia, is hosting a webinar on April 12, 2025, from 11 a.m. to 3 p.m. This session will delve into the Crystal Substrate Bonding Technologies and Algorithms (CRYSTAL) initiative designed to improve the bonding of thin-film crystals.
Significance for Sensors and Communications
Bonding single-crystal thin films using techniques such as electro-optic, acousto-electric, acousto-optic, magneto-optic, and magneto-electric methods is critical for modern sensor and communication technologies. Achieving efficient wafer bonding with compatible substrates is an essential step in integrating these single-crystal films into multifunction devices. Currently, traditional analytical methods do not adequately support the study of wafer bonding.
The goal of the CRYSTAL initiative is to develop generalized models that could accelerate research into multifunction materials and their integration into various applications. These models will enable exploration of the bonding mechanisms between thin films and substrates under conditions that mimic real-world environments.
Invitation to Propose Solutions
DARPA is looking for proposals that focus on modeling and simulation, aiming to understand how specific process conditions influence the formation of crystal-substrate wafer bonds. The agency encourages industry participants to create a bonding model that showcases multifunction properties for the material-substrate pairing.
Registration Information
Companies interested in attending the webinar are encouraged to register by April 1, 2025, at https://events.sa-meetings.com/website/83711/. Participation is free of charge.
For any inquiries, you can reach out to DARPA via email at l@darpa.mil. Additional information can be found at https://sam.gov/opp/3ee4921500324f38918f8a004fb11ecb/view.
About the Author: John Keller is the Editor-in-Chief at Military & Aerospace Electronics Magazine, providing in-depth insights into the latest electronics and optoelectronic technologies in military, space, and commercial aviation applications since 1989.
